Chalmers results on carbon based through-silicon-vias
Tuesday, 20 December 2011 06:56
Akos Kukovecz
Through-silicon vias (TSVs) promise to speed up the communications among all the chips that make up an electronic system by stacking them in 3-D instead of laying them out flat on circuit boards. Unfortunately, filling the vias with copper causes problems with thermal expansion, since copper expands more than the surrounding silicon. Carbon nanotubes could solve this problem.
"Carbon nanotubes have much better properties than copper, both in terms of thermal and electrical conductivity”, said Kjell Jeppsson, a member of the Chalmers research team. "They expand about the same amount as the surrounding silicon while copper expands more, which results in mechanical tension that can cause the components to break." Other team members included Teng Wang and Johan Liu.
http://www.eetimes.com/electronics-news/4231311/Researchers--Carbon-better-than-copper-for-TSVs
Last Updated on Tuesday, 20 December 2011 07:43
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Development on bimodal conductive adhesives
Tuesday, 20 September 2011 18:37
Lilei Ye
High conductive isotropic conductivie adhesives (ICAs) that incorporated both micron-sized silver flakes and micron-sized silver spherical particles into the SHT6 resin has been developed. This work was collaborated with research groups from Chalmers and SHT, and the related paper "A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability" was published in ECS Transactions, 34, 583-588 (2011). It shows in the paper that an appropriate loading of micron-sized silver spherical particles filled the space and increased the contact area between silver flakes.
Last Updated on Thursday, 22 September 2011 06:49
Low temperature thermal CCVD growth of carbon nanotubes at Szeged
Monday, 19 September 2011 21:50
Akos Kukovecz, Zoltan Konya, Andras Sapi, Niina Halonen, Geza Toth, Krisztian Kordas
Researchers at the Szeged node use conventional thermal catalytic chemical vapor deposition (CCVD) systems for the synthesis of multiwall carbon nanotubes. Such systems are known to operate above 600 Celsius using traditional hydrocarbon feedstocks and transition metal catalysts.
Last Updated on Tuesday, 20 December 2011 07:32
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Stable suspensions of MWCNTs in polar solvent by reactive ball milling functionalization at Szeged
Monday, 19 September 2011 22:30
Gabor Kozma, Zoltán Kónya, Ákos Kukovecz
Szeged researchers have adapted the polyol nanotube functionalization process originally developed by David L. Carroll’s group (http://pubs.acs.org/doi/abs/10.1021/nl025856b) to decorate the surface of multi-wall carbon nanotubes with –OH functional groups, thus creating nanotubes that are dispersable in polar solvents. The motivation behind this research was that some important polymeric resins investigated by other THEMA-CNT groups as potential matrices for CNT-containing thermally conductive pastes and glues require that additives are introduced in a polar solvent.
Last Updated on Tuesday, 20 December 2011 07:29
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Aixtron Black Magic 2 inch PECVD system is installed at UOulu
Sunday, 18 September 2011 17:20
Geza Toth, Olli Pitkänen, Krisztian Kordas
Aixtron Black Magic 2-inch PECVD system was installed at University of Oulu in June, 2011. The equipment was partially funded by the THEMA-CNT project. With the new plasma enhanced chemical vapor deposition system experiments have already begun. Researchers Olli Pitkänen and Áron Dombovári have succefully tested carbon nanotubes growth with Low Pressure Chemical Vapor Deposition (LPCVD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) methods. The new system is equipped with 2-inch bottom heater and is installed with acetylene (C2H2) as a precursor gas and hydrogen (H2) or ammonia (NH3) as a reducing gas. Nitrogen (N2) or argon (Ar) is used as a nonreactive gas to dilute the reactants as well as to vent the reactor chamber after the CNT growth process. The system is also equipped with an optional, unique "top heater" technology which should allow us to grow CNTs below 500 oC.
Last Updated on Monday, 19 September 2011 10:45
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